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Fully automatic double-sided exposure device for φ300mm (12-inch) wafers.

Fully automatic double-sided exposure device for φ300mm (12-inch) wafers.

Efficient production at each engineering integration!!!

<Features> MLCSP, a dual-side alignment exposure device for C-MOS backside wiring. Equipped with an environment (Foup), compatible with GEM300 and OHT. Spin coater and developer can also be integrated, allowing for fully automated processes from resist coating to exposure and development. Patterning is possible (optional). Automatic reticle exchange (optional).

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment

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